ISO/TS 10303-1698:2006 - Industrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module design

Withdrawn (Edition 1, 2006)

New version available: ISO/TS 10303-1698:2018

Abstract

ISO/TS 10303-1698:2006 specifies the application module for Layered interconnect module design.

The following are within the scope of ISO/TS 10303-1698:2006:

design features;
material stackup;
design patterns;
metalization;
functional and physical network listing;
design layers;
artwork layers;
passages;
items within the scope of application module Component grouping, ISO/TS 10303-1656;
items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
items within the scope of application module Footprint definition, ISO/TS 10303-1646;
items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
items within the scope of application module Interconnect module usage view, ISO/TS 10303-1686;
items within the scope of application module Interconnect physical requirement allocation, ISO/TS 10303-1689;
items within the scope of application module Part template extension, ISO/TS 10303-1718;
items within the scope of application module Physical connectivity definition, ISO/TS 10303-1755.

General information

Status
: Withdrawn

Publication date
: 2006-12

Stage
: Withdrawal of International Standard [95.99]
Edition
: 1

Number of pages
: 67
Technical Committee :
ISO/TC 184/SC 4

ICS :
25.040.40
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