This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …
Resumen
ISO/TS 10303-1682:2018-11 specifies the application module for Interconnect 2D shape.
The following are within the scope of ISO/TS 10303-1682:2018-11:
- embedded physical component location;
- continuous planar feature shape definition.
Informaciones generales
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Estado: PublicadoFecha de publicación: 2018-11Etapa: Norma Internacional confirmada [90.93]
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Edición: 5Número de páginas: 11
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Comité Técnico :ISO/TC 184/SC 4ICS :25.040.40
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Ciclo de vida
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Anteriormente
RetiradaISO/TS 10303-1682:2014
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Ahora