This document defines the relevant properties for coupling lightwaves into and out of integrated optical chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibres, integrated optical chips) related to coupling properties.
Status: PublishedPublication date: 2021-10
Edition: 2Number of pages: 9
Technical Committee: ISO/TC 172/SC 9 Laser and electro-optical systems
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