Reference number
ISO/TS 10303-1689:2010
© ISO 2024
Technical Specification
ISO/TS 10303-1689:2010
Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation
Edition 3
2010-07
Withdrawn
Withdrawn (Edition 3, 2010)

Abstract

ISO/TS 10303-1689:2010-07 specifies the application module for Interconnect physical requirement allocation.

The following are within the scope of ISO/TS 10303-1689:2010-07:

  • thermal isolation requirement definition;
  • electrical isolation requirement definition;
  • thermal isolation template for substrate design;
  • electrical isolation template for substrate design;
  • length tolerance on spacing requirement;
  • allocation of an isolation requirement to a shield realized as part of an interconnect substrate.

General information

  • Status
     : Withdrawn
    Publication date
     : 2010-07
    Stage
    : Withdrawal of International Standard [95.99]
  • Edition
     : 3
    Number of pages
     : 8
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
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